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 M54640P
Stepper Motor Driver
REJ03F0042-0100Z Rev.1.0 Sep.19.2003
Description
The M54640P is a semiconductor IC to drive a stepper motor by the bipolar method.
Features
* * * * * * Bipolar and constant-current drive Wide current control rage (20 - 800mA) Wide supply voltage drive range (10 - 40V) Built in flywheel diodes Current level can be changed by steps or continuously. Built in a thermal shutdown circuit
Application
Printer, FDD, HDD, Fax
Function
The M54640P drives a stepper motor by the bipolar drive method to change the current direction of a single coil and controls the current direction with PHASE input pin. In order to obtain higher efficiency, the constant current drive system to control the coil current is introduced. The current value can be selected among four levels (0 to max.) by selecting the combination of three internal comparators by logic input. It also can be continuously changed by controlling the reference voltage. Conversion to voltage is conducted by the current value sensing resistor (Rs) and the voltage is sensed with each comparator, and then each comparator output triggers monomulti and the current is cut for a certain time (tOFF) by utilizing the inductance of the coil. Also, diodes needed for choppering and a thermal shutdown circuit as a countermeasure against overvoltage are built in this circuit.
Pin Configuration
Output MB 1 One-shot-multi T 2 time constant Output power VMM 3 supply 4 GND 5 Power supply VCC Output current value setting Output current direction switching I1 6 7 16 E 15 MA 14 13 GND 12 11 VR 10 C 9 Io Comparator reference input Comparator input Output current setting Current sensor Output
VMM Output power supply
M54640P
Ph 8
Outline 16P4
Rev.1.0, Sep.19.2003, page 1 of 9
M54640P
Block Diagram
Comparator reference input VCC VR 11 6 Schmitt trigger Cutput current Ph 8 direction switcing I1 7 I0 9 >1 >1 1 1 1 Output MA Output MB 3 VMM 14 Output power supply
15
1
Output current value setting
00 VKH
01
10
11
VKM Monostable tOFF = 0.69 * RT CT Current sensor
VKL 4 GND 5 12 13 10 C Comparator input 2
1
6
T One-shot-multi time constant
E Current sensor
Absolute Maximum Ratings
(Ta = 25C, unless otherwise noted.)
Parameter Supply voltage Output supply voltage Logic input voltage Analog input voltage Comparative input voltage Logic input current Analog input current Output supply current Power dissipation Operating temperature Storage temperature Symbol VCC VMM VL VC VR IL IC IMM Pd Topr Tstg Ratings -0.3 to 7 -0.3 to 45 -0.3 to 6 -0.3 to Vcc -0.3 to 15 -10 -10 1000 1.92 -20 to 75 -55 to 125 Unit V V V V V mA mA mA W C C Mounted on a board Conditions
Note : Every voltage value is measured when the voltage at GND pin is 0V. The maximum and the minimum of each voltage value are shown in absolute values. Regarding current directions, inflow current is shown in a positive value and outflow current is shown in a negative value. The maximum and the minimum of each current value are shown in absolute values.
Rev.1.0, Sep.19.2003, page 2 of 9
M54640P
Recommended Operating Condition
(Ta = 25C, unless otherwise noted.)
Limits Parameter Supply voltage Output supply voltage Output current Logic input rise time Logic input fall time Thermal shutdown temperature Symbol VCC VMM IO tPLH tPHL TON Min. 4.75 10 20 Typ. 5 Max. 5.25 40 800 2 2 175 Unit V V mA S S C
Electrical characteristics
(Ta = 25C, VCC = 5.0V, unless otherwise noted.)
Limits Parameter Logic input voltage Comparator threshold "H" "L" Symbol VIH VIL VCH VCM VCL Comparator input current Output cutoff current Saturation voltage Cutoff time Turnoff delay Supply current Logic input current "H" "L" ICO IOFF Vsat tOFF td ICC IIH IIL 25 30 1.6 Min. 2.0 0 400 240 75 -20 430 260 90 Typ. Max. VCC 0.8 450 280 100 20 100 4.0 35 2.0 25 20 -0.4 A A V S S mA A mA Unit V mV Test conditions VCC=5V VR=5V, I0=I1=0 VR=5V, I0=1,I1=0 VR=5V, I0=0, I1=1 I0=I1=1(Ta=25C) The voltage at the sensing resistor is not included. IO=500mA VMM=10V, tON 5s Ta=25C, dVK/dt 50mV/s VCC=5V VI=2.4V VI=0.4V
Rev.1.0, Sep.19.2003, page 3 of 9
M54640P
Switching Characteristics
Test Circuit
CT 1 MB 2T 3 VMM RT 4 GND 5 6 VCC 7 I1 8 Phase GND 12 VR 11 C 10 I0 9 CC 13 RC E 16 MA 15 VMM 14 CV RS VCC
RS :1 RC : 1k RT : 56k CC : 820pF CT : 820pF CV : 47F
Switching Waveforms
VMA - VMB or VMB - VMA tOFF = 0.69RTCT 1
1/2
tON
tOFF
td
VCH VCM VCL
Rev.1.0, Sep.19.2003, page 4 of 9
M54640P
Application Description
* PHASE INPUT Phase input decides the output mode.
Phase H L MA H L MB L H
* I0, I1 I0 and I1 fixed based on the comparison voltage VR decide the output current level. The current level can be continuously changed by changing the voltage at VR continuously.
I0 H L H L I1 H H L L Current level 0 Low Average High
* Current sensor When the voltage fall at the current sensing resistor and the selected current level becomes of the same level, the comparator triggers the monostable. Then, the output stage is cut off for a certain time (tOFF). During this cutoff time, the current volume decreases slightly and falls short of the comparison level. After the cutoff time (tOFF), the output stage is in ON state again. This operation is repeated. * Single pulse generator At the comparator output rise edge, the monostable is triggered. The pulse width of the monostable at the external timing Rt and Ct is as follows.
tOFF = 0.69 x RtCt
Retrigger during tOFF is neglected. * Analog control The output current level can be continuously changed by changing the voltage at VR or the feedback voltage to the comparator.
Rev.1.0, Sep.19.2003, page 5 of 9
M54640P
Timing Chart
2-phase excitation
Phase A Phase B
I0, 1 = (A) = 0 I0, 1 = (B) = 0
1-2-phase excitation Phase A Phase B
I0, 1 = (A)
I0, 1 = (B)
Microstep (divided into six)
Phase A
Phase B
I0 (A) I1 (A)
I0 (B)
I1 (B)
Rev.1.0, Sep.19.2003, page 6 of 9
M54640P
Typical Characteristics (Absolute maximum ratings)
Safety operating temperature
1.0 A : Recommended 0.8
Output current Io (A)
B : Schottky diodes should be externally connected between output pins and power supply pins. B C : Schottky diodes should be externally instaalled between output pins and power supply pins and between output pins and GND pin.
0.6
0.4 A 0.2 C
0
0
10
20
30
40 45
50
Output VMM (V)
Thermal derating
10.0 j-c = 10C/W
Allowable power dissipation (W)
8.0
6.0
C
4.0 B 2.0 A
A : Mounted on a 25cm2 glass epoxy board which is coated with copper on one side. c-a = 45C/W B : 10cm2 aluminum heat sink (1t) is used. c-a = 25C/W C : 100cm2 aluminum heat sink (1t) is used. c-a = 10C/W Tj(max) = 150C
0
0
25
50 Ambient (C)
75
100
Rev.1.0, Sep.19.2003, page 7 of 9
M54640P
Application Example
1 820pF 1k 5V
16 15 14 13 12
11 10
9
M54640P
1 2 3 4 5 6 7 8
820pF 56k 1 1k 820pF
Phase A I0A I1A
24V 47F
16 15 14 13 12 11 10 Stepper motor
9
M54640P
1 2 3 4 5 6 7 8 Phase B I0B 56k I1B
820pF
Precautions for use
(1) When the whole output current changes by a large margin (for example, when overheat protection operation causes intermittent flow of output current), the supply voltage may undergo a change. Therefore, selection and wiring of power supply should be conducted cautiously to avoid such a situation that the supply voltage exceeds the absolute maximum ratings. (2) When the supply voltage changes by a large margin, the operation of this IC may become unstable. In this case, the change of supply voltage can be controlled by connecting a capacitor at the point near to IC pin between Vcc pin and GND pin. (See above application example.) (3) Thermal shutdown function * The state of thermal shutdown operation may differ according to the way of wiring within a board. Therefore, sufficient board evaluation should be conducted before use. When the board is changed, operation on the replacing board should be evaluated. * The circuit board on which this IC is mounted is designed to realize low impedance between power supply and output pin. Therefore, it is desirable to take a safe measure such as fixing a fuse to avoid such a situation that the board is damaged by a fire when output pin is internally short-circuited by excessively applied surge voltage by accident.
Rev.1.0, Sep.19.2003, page 8 of 9
M54640P
16P4
JEDEC Code -- Weight(g) 1.0 Lead Material Alloy 42/Cu Alloy
MMP
Plastic 16pin 300mil DIP
Package Dimensions
EIAJ Package Code DIP16-P-300-2.54
E
1
8
D
Symbol
A A2
L
e
b1
b
b2
A1
SEATING PLANE
A A1 A2 b b1 b2 c D E e e1 L
Dimension in Millimeters Min Nom Max -- -- 4.5 0.51 -- -- -- 3.3 -- 0.4 0.5 0.59 1.4 1.5 1.8 0.9 1.0 1.3 0.22 0.27 0.34 18.8 19.0 19.2 6.15 6.3 6.45 -- 2.54 -- -- 7.62 -- 3.0 -- -- 0 -- 15
e1
Rev.1.0, Sep.19.2003, page 9 of 9
16 9
c
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
(c) 2003. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon 1.0


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